Application of Surface Mounting Technology in Intelligent Circuit-Breakers 表面贴装技术在智能型断路器中的应用
In the surface mounting technology, the result of the solder printing is very big to the product quantity. 在电子装联技术中,焊膏印刷的效果对产品质量关系极大。
The existence conformations and functions of gold in such boards and blocks have been changed greatly with the development of flaky elements and Surface Mounting Technology ( SMT). 片状元器件和表面安装技术的发展,使电脑板卡中金的存在形态和功能发生了较大变化。
Surface Mounting and Chip Bonding Technology 表面组装与芯片键合混合工艺浅探
Surface Mounting Technology and Its Applications in Optoelectronic Devices 表面安装技术及其在光电子器件中的应用
To Make Low-pass Filter Modules Using Surface Mounting Technology 表面贴装低通滤波器模块的制作
Information Automatic Gaining of Soldered Joint on Surface Mounting Technology Printed Circuit Board 表面组装印刷电路板上焊点信息的自动获取
Mounting of PCB by Surface Mounting Technology 表面安装印制板
Requirements for Printed Circult Board Design in Surface Mounting Technology 表面贴装技术中对印刷电路板的设计要求
Considered as a special IC, the pressure sensor integrates diffusion silicon sensing element, circuit for temperature compensation and signal conditioned circuit on a chip in the form of thick film hybrid IC, through using thick film technology and surface mounting technology. 将集成压力传感器作为一种特殊的集成电路,采用厚膜工艺与表面组装技术,以厚膜混合集成电路的形式,实现了扩散硅力敏元件与温度补偿电路及信号放大电路的集成。
The main performances of the gold-silicon surface barrier detectors with new mounting configuration manufactured by advance technology are described in this report. 文中介绍了用新工艺制成的新结构金硅面垒型探测器的主要性能。
However, factors like circuit design, material selection, assembly process and service environment can cause failures during surface mounting technology ( SMT) or service. 然而,在表面贴装器件时或使用过程中,常会因电路设计、板件选材、组装工艺、服役环境等因素造成PCB失效。
As the development of Surface Mounting Technology towards to lightly, thin and micro-miniature, traditional inspection arithmetic can not satisfy productive demand so that Automatic Optical Inspection ( AOI) has gotten an extensive investigation. 随着微电子表面组装技术不断向轻型化、薄型化、微小化发展,传统的检测方法已经不能满足实际生产的需要,因此,自动光学检测技术得到广泛的研究。